FormatTWIN ODYN P2484 LC

Density Optimized System Solution Providing Leadership Performance for HPC and AI

Intel® Xeon® Platinum 9200 Processors Advanced Performance

  • Leadership CPU performance per socket with Intel’s highest core count, Intel® Xeon® Platinum 9200 processors
  • Double the memory bandwidth for memory-intensive workloads with 12 memory channels per CPU, 24 memory channels per compute module
  • New Intel® Deep Learning Boost Instructions for data analytics greatly accelerates inference performance
  • Multi-Chip packaging optimized for density and performance

Density Optimized 2U Rack Server with Air-Cooled
and Liquid-Cooled Options

  • 4 compute modules per 2U chassis which can support multiple compute module types in a single chassis
  • 2 CPU compute module design with advanced cooling technology for high flow rate air or liquid cooled for CPUs, VRs, DIMMs, and memory VRs for high heat capture ratio
  • Up to 350W processor TDP for high performance workloads in a 2U air cooled chassis, up to 400W processor TDP with liquid-cooled versions
  • Up to 2 x16 PCIe slots in 1U compute modules, up to 4 x16 PCIe slots in 2U compute modules for network expansion options
  • Support for 2x M.2 SATA/NVMe storage devices per 1U compute module, up to 2x M.2 SATA/NVMe and 2x U.2 NVMe storage devices per 2U compute module
  • Hot-swappable compute modules, storage, fans, and power supplies

Compute Module: FormatNode ODYN P024 LC
Chassis Form Factor 2U Rack front IO
Integrated Systems Available Yes
Integrated BMC with IPMI 2.0
TDP 350 W
Included Items (1)S9200WK Compute Module
(2)1U PCIe Riser
(1) Liquid cooling sled solution
(2) M.2 Heatsink
Board Chipset Intel® C621 Chipset
Description S9200WK Compute Module for use in Intel® Data Center Blocks featuring Intel® Xeon® Platinum 9200 processors housed in new 2U front I/O Intel® Server Chassis FC2000.
Memory Specifications per Node
Max Memory Size 3 TB
Memory Types DDR4 RDIMM 2933
Max # of Memory Channels
Expansion Options per Node
PCIe x16 Gen 3
Package Specifications per Node
Max CPU Configuration
Advanced Technologies
Intel® Optane™ Memory Supported
 Server Chassis
Chassis Form Factor 2U Front IO, 4 node Rack
Chassis Dimensions 16.93” x 36.61” x 3.44”
Power Supply
2100 W
Power Supply Type
# of Power Supply Included
Redundant Fans
Redundant Power Supported
Supplemental Information
Liquid Cooled 2U flexible multi node chassis with front IO, capable of supporting either two, three, or four independent warm-swap compute nodes and 3x hot-swap CRPS 2100W (Platinum) or 1600W (Titanium) PSUs.
Package Specifications
Max CPU Configuration