Density Optimized System Solution Providing Leadership Performance for HPC and AI
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Intel® Xeon® Platinum 9200 Processors Advanced Performance
Density Optimized 2U Rack Server with Air-Cooled
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Compute Module: FormatNode ODYN P024 LC |
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Chassis Form Factor | 2U Rack front IO |
Integrated Systems Available | Yes |
Integrated BMC with IPMI | 2.0 |
TDP | 350 W |
Included Items | (1)S9200WK Compute Module (2)1U PCIe Riser (1) Liquid cooling sled solution (2) M.2 Heatsink |
Board Chipset | Intel® C621 Chipset |
Description | S9200WK Compute Module for use in Intel® Data Center Blocks featuring Intel® Xeon® Platinum 9200 processors housed in new 2U front I/O Intel® Server Chassis FC2000. |
Memory Specifications per Node |
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Max Memory Size | 3 TB |
Memory Types | DDR4 RDIMM 2933 |
Max # of Memory Channels |
24
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Expansion Options per Node |
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PCIe x16 Gen 3 |
2
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Package Specifications per Node |
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Max CPU Configuration |
2
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Advanced Technologies | |
Intel® Optane™ Memory Supported |
Yes
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Server Chassis | |
Chassis Form Factor | 2U Front IO, 4 node Rack |
Chassis Dimensions | 16.93” x 36.61” x 3.44” |
Power Supply |
2100 W
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Power Supply Type |
AC
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# of Power Supply Included |
3
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Redundant Fans |
Yes
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Redundant Power Supported |
Yes
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Supplemental Information | |
Description |
Liquid Cooled 2U flexible multi node chassis with front IO, capable of supporting either two, three, or four independent warm-swap compute nodes and 3x hot-swap CRPS 2100W (Platinum) or 1600W (Titanium) PSUs.
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Package Specifications | |
Max CPU Configuration |
8
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